The HPC-F3400 is a single-wafer cleaning system developed by Huahai Qingke to meet the advanced packaging industry's cutting-edge process requirements. Integrating diverse advanced chemical and physical cleaning technologies, this equipment delivers high throughput and excellent process stability. Featuring a stacked chamber design, it incorporates a frame-ring protection mechanism in the process chamber and combines multiple cleaning methods—including chemical immersion, chemical spray, megasonic cleaning, Nanospray cleaning, and brush scrubbing. With its modular architecture, the system can be flexibly configured according to customers' specific process needs, continuously meeting the increasingly stringent wafer surface cleanliness requirements of advanced packaging and supporting mass production for various advanced packaging manufacturing processes.
The process chambers are stacked, with a maximum of 4
Frame rings can be configured for protection
Each chamber can accommodate up to three types of chemical
Supports IPA drying, with a fire extinguishing device
Three types of physical cleaning nozzles can be optionally equipped. Nanospray, Mega, PVA Brush with pressure control
Up to 4 swing arms are available, supporting point cleaning, uniform speed and variable speed cleaning