Versatile-GR300 is a fully automatic edge-retaining grinding machine independently developed by Hwatsing for the power semiconductor . It enables end-to-end automated operation. The equipment is highly compatible, supporting 8-inch and 12-inch wafers（8-inch are supported by an optional accessory）. It also incorporates advanced edge-retaining grinding technology, which allows the wafer to retain greater bend resistance after thinning. This not only eliminates edge chipping during wafer thinning but also significantly reduces wafer warpage risk.
Compatible with 8/12-inch wafers
Precision control of thickness variation & ring width
Supports processing of various edge ring profiles
Enables precision grinding of large-size ultra-thin wafers