The Universal-S300 is a 12-inch CMP equipment developed by Hwatsing to meet industry-leading demands, integrating advanced polish-processes, high efficiency, and exceptional stability. This tool is equipped a stacked layout architecture to achieve high production capacity within limited machine space, equipped with an efficient transport and clean-system. Its modular design accommodates diverse customer requirements for different processes, meeting the growing need for enhanced cleanliness. The Universal-S300 enables superior global nanoscale planarization of wafers, fulfilling the requirements of advanced process technologies and enabling mass application in manufacturing processes such as integrated circuits and advanced packaging.
Stacking architecture for polisher and cleaner, to achieve maximum production capacity with compact layout
Compatible with polishing heads ，with 8/12 independent air pressure zones
The polisher head is configurable with 1:1 or 2:3 platen-to-head ratios, meeting customers' diverse process requirements such as high productivity and high precision
Efficient transfer path design significantly improves the transfer speed from polisher to cleaner
Buff clean chamber utilizes mechanical shear-force and chemical reactions to enhance surface particle cleaning capability