A fully automatic edge-retaining wafer grinder compatible with 6/8-inch wafers, specifically developed for power semiconductor applications. Equipped with advanced edge-preservation gringding technology, it ensures superior mechanical strength after gringding, effectively preventing edge chipping and minimizing wafer warpage risks
Compatible with 6/8-inch wafers
Precision control of thickness variation & ring width
Supports processing of various edge ring profiles
Enables precision grinding of ultra-thin wafers